{"product_id":"advanced-ic-development-kit-7-prototype-boards-for-tqfp-ufqfpn-vfqfpn-ssop-lqfp-and-soic-d-perfect-for-electronics-prototyping","title":"IC Development Kit: 11 Prototype Boards for TQFP, UFQFPN, VFQFPN, SSOP, LQFP, and SOIC-D - Perfect for Electronics Prototyping","description":"\u003ch2\u003e\n\u003cstrong data-mce-fragment=\"1\"\u003eOverview:\u003c\/strong\u003e\u003cspan data-mce-fragment=\"1\"\u003e \u003c\/span\u003e\n\u003c\/h2\u003e\n\u003cp\u003e\u003cspan data-mce-fragment=\"1\"\u003eElevate your electronics development with our versatile IC Development Kit, featuring 11 meticulously designed prototype (market) boards. Catering to a wide array of IC packages including UFQFPN28, UFQFPN32, VFQFPN36, UFQFPN48, LQFP48, TQFP64, VFQFPN68, SSOP (0.65 pitch, \u003cstrong\u003ebreadboard-adapted\u003c\/strong\u003e), and SOIC-D (16\/1SC-70, \u003cstrong\u003ebreadboard-adapted\u003c\/strong\u003e), this kit is engineered to support your innovative projects from concept through to testing.\u003cbr\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003ch2\u003e\n\u003cspan data-mce-fragment=\"1\"\u003e\u003cbr\u003e\u003c\/span\u003e\u003cspan data-mce-fragment=\"1\"\u003eBenefits:\u003c\/span\u003e\n\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eUser-Friendly Design:\u003c\/strong\u003e With clear labeling, easy-to-access ports, and a straightforward interface, each board is built to facilitate an intuitive development experience, regardless of your skill level.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eAccelerate Your Projects:\u003c\/strong\u003e Save time with a ready-to-use solution that simplifies the prototyping process, allowing you to focus on innovation and design.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eEnhance Your Learning:\u003c\/strong\u003e Whether you're a student or a professional looking to expand your skill set, our kit offers a hands-on approach to understanding and applying electronic principles.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eVersatility:\u003c\/strong\u003e From IoT devices to consumer electronics prototypes, the possibilities are endless, providing you with the flexibility to explore various fields and applications.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003ch2\u003e\u003cstrong\u003eIdeal for:\u003c\/strong\u003e\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eElectronics Engineering Students\u003c\/li\u003e\n\u003cli\u003eDIY Electronics Hobbyists\u003c\/li\u003e\n\u003cli\u003eProfessional Engineers and Designers\u003c\/li\u003e\n\u003cli\u003eTech Educators and Tutors\u003cbr\u003e\u003cbr\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eSpecifications:\u003c\/h2\u003e\n\u003cp\u003eAll boards are 2-layer with full pins enumeration\u003cspan\u003e\u003cbr\u003e\u003c\/span\u003e\u003cspan\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\u003cspan\u003e\u003cstrong\u003eUFQFPN28\u003c\/strong\u003e - 1 pc;\u003cbr\u003e\u003cstrong\u003eDim:\u003c\/strong\u003e 33x33 mm; \u003cbr\u003e\u003cstrong\u003e2 through-hole pads\u003c\/strong\u003e for each pin;\u003cbr\u003e\u003cstrong\u003e4 through-hole pads for ground and 4 for power\u003c\/strong\u003e delivery isolated from IC, corresponding for top and bottom copper layers;\u003cbr\u003e\u003cstrong\u003ePinch:\u003c\/strong\u003e 0.5mm\u003cbr\u003e\u003cbr\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003e\u003cstrong\u003eUFQFPN32 \u003c\/strong\u003e- 1 pc;\u003cbr\u003e\u003cstrong\u003eDim:\u003c\/strong\u003e 36x36 mm; \u003cbr\u003e\u003cstrong\u003e2 through-hole pads\u003c\/strong\u003e for each pin\u003cbr\u003e\u003cstrong\u003e4 through-hole pads for ground and 4 for power\u003c\/strong\u003e delivery isolated from IC, corresponding for top and bottom copper layers;\u003cbr\u003e\u003cstrong\u003eGround IC pad\u003c\/strong\u003e connected to ground pins;\u003cbr\u003e\u003cstrong\u003ePinch:\u003c\/strong\u003e 0.5mm\u003cbr\u003e\u003cbr\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003e\u003cstrong\u003eVFQFPN36 \u003c\/strong\u003e- 1 pc;\u003cbr\u003e\u003cstrong\u003eDim:\u003c\/strong\u003e 38x38 mm; \u003cbr\u003e\u003cstrong\u003e2 through-hole pads\u003c\/strong\u003e for each pin;\u003cbr\u003e\u003cstrong\u003e4 through-hole pads for ground and 4 for power\u003c\/strong\u003e delivery isolated from IC, corresponding for top and bottom copper layers;\u003cbr\u003e\u003cstrong\u003eGround IC pad\u003c\/strong\u003e connected to ground pins;\u003cbr\u003e\u003cstrong\u003ePinch:\u003c\/strong\u003e 0.5 mm\u003cbr\u003e\u003cbr\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003e\u003cstrong\u003eUFQFPN48\u003c\/strong\u003e - 1 pc;\u003cbr\u003e\u003cstrong\u003eDim:\u003c\/strong\u003e 48x48 mm; \u003cbr\u003e\u003cstrong\u003e2 through-hole pads\u003c\/strong\u003e for each pin;\u003cbr\u003e\u003cstrong\u003e4 through-hole pads for ground and 4 for power\u003c\/strong\u003e delivery isolated from IC, corresponding for top and bottom copper layers;\u003cbr\u003e\u003cstrong\u003eGround IC pad\u003c\/strong\u003e connected to ground pins;\u003cbr\u003e\u003cstrong\u003ePinch:\u003c\/strong\u003e 0.5 mm\u003cbr\u003e\u003cbr\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\n\u003cspan\u003e\u003cstrong\u003eLQFP48\u003c\/strong\u003e - 1 pc;\u003cbr\u003e\u003cstrong\u003eDim:\u003c\/strong\u003e 46x46 mm; \u003cbr\u003e\u003cstrong\u003e2 through-hole pads\u003c\/strong\u003e for each pin;\u003cbr\u003e\u003cstrong\u003e4 through-hole pads for ground and 4 for power\u003c\/strong\u003e delivery isolated from IC, corresponding for top and bottom copper layers;\u003cbr\u003e\u003cstrong\u003ePinch:\u003c\/strong\u003e 0.5 mm\u003c\/span\u003e\u003cspan\u003e\u003cbr\u003e\u003cbr\u003e\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cspan\u003e\u003cstrong\u003eTQFP64\u003c\/strong\u003e - 1 pc;\u003cbr\u003e\u003c\/span\u003e\u003cspan\u003e\u003cstrong\u003eDim:\u003c\/strong\u003e 51x51 mm; \u003cbr\u003e\u003cstrong\u003e2 through-hole pads\u003c\/strong\u003e for each pin;\u003cbr\u003e\u003cstrong\u003e4 through-hole pads for ground and 4 for power\u003c\/strong\u003e delivery isolated from IC, corresponding for top and bottom copper layers;\u003cbr\u003e\u003cstrong\u003ePinch:\u003c\/strong\u003e 0.5mm\u003cbr\u003e\u003c\/span\u003e\u003cbr\u003e\n\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003e\u003cstrong\u003eVFQFPN68\u003c\/strong\u003e - 1 pc;\u003cbr\u003e\u003cstrong\u003eDim:\u003c\/strong\u003e 51x51 mm; \u003cbr\u003e\u003cstrong\u003e2 through-hole pads\u003c\/strong\u003e for each pin;\u003cbr\u003e\u003cstrong\u003e4 through-hole pads for ground and 4 for power\u003c\/strong\u003e delivery isolated from IC, corresponding for top and bottom copper layers;\u003cbr\u003e\u003cstrong\u003eGround IC pad\u003c\/strong\u003e connected to ground pins;\u003cbr\u003e\u003cstrong\u003ePinch:\u003c\/strong\u003e 0.4 mm \u003cbr\u003e\u003cbr\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\n\u003cspan\u003e\u003cstrong\u003eSSOP (Bread board adapted)\u003c\/strong\u003e - 2 pc\u003cbr\u003e\u003c\/span\u003e\u003cspan\u003e\u003cstrong\u003eDim:\u003c\/strong\u003e 16x31 mm;\u003cbr\u003e\u003cstrong\u003eBread Board Compatible;\u003c\/strong\u003e\u003cbr\u003e\u003cstrong\u003ePower Layers;\u003c\/strong\u003e\u003cbr\u003e\u003cstrong\u003e24 pins;\u003c\/strong\u003e\u003cbr\u003e\u003cstrong\u003ePinch:\u003c\/strong\u003e 0.65\u003cbr\u003e\u003cbr\u003e\u003c\/span\u003e\u003cspan\u003e\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003e\u003cstrong\u003eSOIC-D - 16\/1sc-70 (Bread board adapted) \u003c\/strong\u003e\u003cstrong\u003e\u003c\/strong\u003e- 2pc\u003cbr\u003e\u003cstrong\u003eDim: \u003c\/strong\u003e16x21 mm;\u003cbr\u003e\u003cstrong\u003eBread Board Compatible;\u003c\/strong\u003e\u003cbr\u003e\u003cstrong\u003e16 pins;\u003c\/strong\u003e\u003cbr\u003e\u003cstrong\u003ePinch: \u003c\/strong\u003e1.27\u003cbr\u003e\u003cbr\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e \u003c\/p\u003e","brand":"TechnoMancer's Lab","offers":[{"title":"Default Title","offer_id":44655929491610,"sku":"TMLICKITV111PCS","price":24.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0513\/5505\/8330\/files\/ic-development-kit-11-prototype-boards-for-tqfp-ufqfpn-vfqfpn-ssop-lqfp-and-soic-d-perfect-for-electronics-prototyping-8097165.jpg?v=1765516032","url":"https:\/\/technomancerlab.com\/products\/advanced-ic-development-kit-7-prototype-boards-for-tqfp-ufqfpn-vfqfpn-ssop-lqfp-and-soic-d-perfect-for-electronics-prototyping","provider":"Technomancer's Lab, Inc","version":"1.0","type":"link"}